Abstract
This letter presents a Si nanowire based tunneling field-effect transistor (TFET) using a CMOS-compatible vertical gate-all-around structure. By minimizing the thermal budget with low-temperature dopant-segregated silicidation for the source-side dopant activation, excellent TFET characteristics were obtained. We have demonstrated for the first time the lowest ever reported subthreshold swing (SS) of 30 mV/decade at room temperature. In addition, we reported a very convincing SS of 50 mV/decade for close to three decades of drain current. Moreover, our TFET device exhibits excellent characteristics without ambipolar behavior and with high Ion}/Ioff ratio (\∼ 105), as well as low Drain-Induced Barrier Lowering of ∼70 mV/V.
| Original language | English |
|---|---|
| Article number | 5719152 |
| Pages (from-to) | 437-439 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 32 |
| Issue number | 4 |
| DOIs | |
| State | Published - Apr 2011 |
| Externally published | Yes |
Keywords
- CMOS technology
- gate-all-around (GAA)
- subthreshold swing (SS)
- top-down
- tunneling field-effect transistor (TFET)
- vertical silicon nanowire (NW) (SiNW)
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