UV/ozone treatment for adhesion improvement of copper/epoxy interface

Shingyu Bok; Guh Hwan Lim; Byungkwon Lim

doi:10.1016/j.jiec.2016.10.031

UV/ozone treatment for adhesion improvement of copper/epoxy interface

Shingyu Bok
, Guh Hwan Lim
, Byungkwon Lim

Department of Advanced Materials Science and Engineering

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

38 Scopus citations

Abstract

We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)₂ by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of ∼0.1 μm.

Original language	English
Pages (from-to)	199-202
Number of pages	4
Journal	Journal of Industrial and Engineering Chemistry
Volume	46
DOIs	https://doi.org/10.1016/j.jiec.2016.10.031
State	Published - 25 Feb 2017

Keywords

Adhesion
Copper
Epoxy
Silane coupling agent
UV/ozone

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10.1016/j.jiec.2016.10.031

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title = "UV/ozone treatment for adhesion improvement of copper/epoxy interface",

abstract = "We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of ∼0.1 μm.",

keywords = "Adhesion, Copper, Epoxy, Silane coupling agent, UV/ozone",

author = "Shingyu Bok and Lim, \{Guh Hwan\} and Byungkwon Lim",

note = "Publisher Copyright: {\textcopyright} 2016 The Korean Society of Industrial and Engineering Chemistry",

year = "2017",

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day = "25",

doi = "10.1016/j.jiec.2016.10.031",

language = "English",

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journal = "Journal of Industrial and Engineering Chemistry",

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T1 - UV/ozone treatment for adhesion improvement of copper/epoxy interface

AU - Bok, Shingyu

AU - Lim, Guh Hwan

AU - Lim, Byungkwon

PY - 2017/2/25

Y1 - 2017/2/25

N2 - We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of ∼0.1 μm.

AB - We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of ∼0.1 μm.

KW - Adhesion

KW - Copper

KW - Epoxy

KW - Silane coupling agent

KW - UV/ozone

UR - https://www.scopus.com/pages/publications/85007179524

U2 - 10.1016/j.jiec.2016.10.031

DO - 10.1016/j.jiec.2016.10.031

M3 - Article

AN - SCOPUS:85007179524

SN - 1226-086X

VL - 46

SP - 199

EP - 202

JO - Journal of Industrial and Engineering Chemistry

JF - Journal of Industrial and Engineering Chemistry

ER -

UV/ozone treatment for adhesion improvement of copper/epoxy interface

Abstract

Keywords

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