Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing

Yoonhyun Kim; Byoungyoon Lee; Seungnam Yang; Inho Byun; Inbum Jeong; Sung Min Cho

doi:10.1016/j.cap.2011.08.003

Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing

Yoonhyun Kim
, Byoungyoon Lee
, Seungnam Yang
, Inho Byun
, Inbum Jeong
, Sung Min Cho

Department of Chemical Engineering

Sungkyunkwan University
Chang Sung Corporation
Donghyun Electronics Corp.

Research output: Contribution to journal › Article › peer-review

125 Scopus citations

Abstract

We have synthesized nano-sized copper hydroxide powder and copper (II) neodecanoate complex that can be decomposed to form copper metal films. Copper conductive ink was then prepared by mixing the powder and complex with a binder in terpineol. The lowest resistivity of 12.5 μΩ cm and 5B level of adhesion strength were obtained with 5% addition of epoxy resin as a binder. The copper ink was then applied to fabricate a loop-type RFID antenna tag and the performance of the antenna was compared with that of conventional copper-etched and silver-paste antenna. The fabricated RFID antenna showed comparable performance to the conventional RFID antenna.

Original language	English
Pages (from-to)	473-478
Number of pages	6
Journal	Current Applied Physics
Volume	12
Issue number	2
DOIs	https://doi.org/10.1016/j.cap.2011.08.003
State	Published - Mar 2012

Keywords

Copper ink
Low temperature curing
Metal film
RFID antenna

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10.1016/j.cap.2011.08.003

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title = "Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing",

abstract = "We have synthesized nano-sized copper hydroxide powder and copper (II) neodecanoate complex that can be decomposed to form copper metal films. Copper conductive ink was then prepared by mixing the powder and complex with a binder in terpineol. The lowest resistivity of 12.5 μΩ cm and 5B level of adhesion strength were obtained with 5\% addition of epoxy resin as a binder. The copper ink was then applied to fabricate a loop-type RFID antenna tag and the performance of the antenna was compared with that of conventional copper-etched and silver-paste antenna. The fabricated RFID antenna showed comparable performance to the conventional RFID antenna.",

keywords = "Copper ink, Low temperature curing, Metal film, RFID antenna",

author = "Yoonhyun Kim and Byoungyoon Lee and Seungnam Yang and Inho Byun and Inbum Jeong and Cho, \{Sung Min\}",

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AU - Kim, Yoonhyun

AU - Lee, Byoungyoon

AU - Yang, Seungnam

AU - Byun, Inho

AU - Jeong, Inbum

AU - Cho, Sung Min

PY - 2012/3

Y1 - 2012/3

N2 - We have synthesized nano-sized copper hydroxide powder and copper (II) neodecanoate complex that can be decomposed to form copper metal films. Copper conductive ink was then prepared by mixing the powder and complex with a binder in terpineol. The lowest resistivity of 12.5 μΩ cm and 5B level of adhesion strength were obtained with 5% addition of epoxy resin as a binder. The copper ink was then applied to fabricate a loop-type RFID antenna tag and the performance of the antenna was compared with that of conventional copper-etched and silver-paste antenna. The fabricated RFID antenna showed comparable performance to the conventional RFID antenna.

AB - We have synthesized nano-sized copper hydroxide powder and copper (II) neodecanoate complex that can be decomposed to form copper metal films. Copper conductive ink was then prepared by mixing the powder and complex with a binder in terpineol. The lowest resistivity of 12.5 μΩ cm and 5B level of adhesion strength were obtained with 5% addition of epoxy resin as a binder. The copper ink was then applied to fabricate a loop-type RFID antenna tag and the performance of the antenna was compared with that of conventional copper-etched and silver-paste antenna. The fabricated RFID antenna showed comparable performance to the conventional RFID antenna.

KW - Copper ink

KW - Low temperature curing

KW - Metal film

KW - RFID antenna

UR - https://www.scopus.com/pages/publications/81155150029

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DO - 10.1016/j.cap.2011.08.003

M3 - Article

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SN - 1567-1739

VL - 12

SP - 473

EP - 478

JO - Current Applied Physics

JF - Current Applied Physics

IS - 2

ER -

Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing

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