Abstract
Ultra thin high quality nitride/oxide gate dielectrics prepared by rapid thermal NM3 nitridation of Si followed by in-situ N2O oxidation are presented. These films showed excellent interface properties, significant lower leakage current (approximately 102X), enhanced reliability, and superior boron diffusion barrier properties compared with SiO2 of identical equivalent oxide thickness.
| Original language | English |
|---|---|
| Pages (from-to) | 55-58 |
| Number of pages | 4 |
| Journal | Microelectronic Engineering |
| Volume | 48 |
| Issue number | 1 |
| DOIs | |
| State | Published - Sep 1999 |
| Externally published | Yes |
| Event | Proceedings of the 1999 11th Biennial Conference on Insulating Films on Semiconductors (INFOS'99) - Kloster Banz, Ger Duration: 16 Jun 1999 → 19 Jun 1999 |