Ultra thin high quality stack nitride/oxide gate dielectrics prepared by in-situ rapid thermal N2O oxidation of NH3-nitrided Si

S. C. Song, H. F. Luan, C. H. Lee, A. Y. Mao, S. J. Lee, J. Gelpey, S. Marcus, D. L. Kwong

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Abstract

Ultra thin high quality nitride/oxide gate dielectrics prepared by rapid thermal NM3 nitridation of Si followed by in-situ N2O oxidation are presented. These films showed excellent interface properties, significant lower leakage current (approximately 102X), enhanced reliability, and superior boron diffusion barrier properties compared with SiO2 of identical equivalent oxide thickness.

Original languageEnglish
Pages (from-to)55-58
Number of pages4
JournalMicroelectronic Engineering
Volume48
Issue number1
DOIs
StatePublished - Sep 1999
Externally publishedYes
EventProceedings of the 1999 11th Biennial Conference on Insulating Films on Semiconductors (INFOS'99) - Kloster Banz, Ger
Duration: 16 Jun 199919 Jun 1999

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