Transfer fabrication technique for embedded and inverted micro/nanostructures

A transfer fabrication technique is developed to construct embedded and inverted micro/nanostructures that cannot be readily built by other methods. Transfer patterning/printing is used for the fabrication, which involves transferring a patterned layer on a flat substrate to another substrate that has a higher work of adhesion with the layer than the flat substrate. The technique is relatively simple and fast (∼10 s). Inversion of a shape that is made possible by the transfer is the basic concept. This inversion allows fabrication of three-dimensional embedded structures through multiple stacking. The technique could open new avenues for various applications.