TY - JOUR
T1 - Toward ultraviolet solution processed ZrOx/IZO transistors with top-gate and dual-gate operation
T2 - Selection of solvents, precursors, stabilizers, and additive elements
AU - Jung, Sung Hyeon
AU - Han, Hyeon Seong
AU - Kim, Young Been
AU - Kim, Dong Su
AU - Deshpande, Nishad G.
AU - Oh, Sang Jun
AU - Choi, Ji Hoon
AU - Cho, Hyung Koun
N1 - Publisher Copyright:
© 2020 Elsevier B.V.
PY - 2020/12/20
Y1 - 2020/12/20
N2 - Low-temperature processed oxide thin-film transistors (TFTs) have been developed by the process of solution-processed metal oxide films using deep ultraviolet (UV) irradiation, although they still suffer from relatively poor electrical performance and severe electrical and chemical instability. This UV coating solution essentially involves chemical damage from acidic or basic precursor ligands; therefore, the top-gate and dual-gate TFTs suffer structurally inherent chemical damage, which limits the freedom of process design. An engineering concept solution using the four functional components of solvent, precursor, stabilizer, and additive was suggested for UV solution coating of high-k zirconium oxide (ZrOx). Here the proposed solvent, stabilizer, precursor, and additive include polar-aprotic N,N-methylformamide, zirconium acetylacetonate, ethanolamine, and oleic acid for polar-aprotic solution, effective photolysis, complete precursor dissolution, and high densification, respectively. The ultrathin ZrOx (15 nm) revealed a low leakage current density of <10−11 mA/cm2 at 1 MV/cm, good breakdown voltage, and a constant capacitance of approximately 260 nF/cm2 at 1 MHz. Similar transfer characteristics of both the bottom and top gates, and a field-effect mobility of 24 cm2/V, without degradation of subthreshold swing and threshold voltage values in the dual-gate, were involved in the chemically durable process and the dense coating conditions of ZrOx, regardless of the IZO and ZrOx stacking sequence.
AB - Low-temperature processed oxide thin-film transistors (TFTs) have been developed by the process of solution-processed metal oxide films using deep ultraviolet (UV) irradiation, although they still suffer from relatively poor electrical performance and severe electrical and chemical instability. This UV coating solution essentially involves chemical damage from acidic or basic precursor ligands; therefore, the top-gate and dual-gate TFTs suffer structurally inherent chemical damage, which limits the freedom of process design. An engineering concept solution using the four functional components of solvent, precursor, stabilizer, and additive was suggested for UV solution coating of high-k zirconium oxide (ZrOx). Here the proposed solvent, stabilizer, precursor, and additive include polar-aprotic N,N-methylformamide, zirconium acetylacetonate, ethanolamine, and oleic acid for polar-aprotic solution, effective photolysis, complete precursor dissolution, and high densification, respectively. The ultrathin ZrOx (15 nm) revealed a low leakage current density of <10−11 mA/cm2 at 1 MV/cm, good breakdown voltage, and a constant capacitance of approximately 260 nF/cm2 at 1 MHz. Similar transfer characteristics of both the bottom and top gates, and a field-effect mobility of 24 cm2/V, without degradation of subthreshold swing and threshold voltage values in the dual-gate, were involved in the chemically durable process and the dense coating conditions of ZrOx, regardless of the IZO and ZrOx stacking sequence.
KW - Organic additive
KW - pH engineering
KW - Polar-aprotic solvents
KW - Thin-film transistor
KW - Ultraviolet solution process
UR - https://www.scopus.com/pages/publications/85088964896
U2 - 10.1016/j.jallcom.2020.156431
DO - 10.1016/j.jallcom.2020.156431
M3 - Article
AN - SCOPUS:85088964896
SN - 0925-8388
VL - 847
JO - Journal of Alloys and Compounds
JF - Journal of Alloys and Compounds
M1 - 156431
ER -