Abstract
Background: Anomaly detection in semiconductor manufacturing is vital for maintaining yield and reducing costs, particularly in high-volume production where inspections are time-consuming and expensive. Aim: We aim to develop a robust, unsupervised deep learning framework for multivariate anomaly detection, addressing limitations in current fault detection and classification systems. Approach: We propose a transformer-based model integrating aggregated z-normalization to mitigate distribution drift and peaks-over-threshold for adaptive thresholding, ensuring reliable performance across varying datasets. Results: The framework achieved an F1 score of 0.9827 on semiconductor datasets, with high precision (0.9866) and minimal false alarms, validated through extensive ablation studies. Conclusions: The proposed solution is scalable and adaptable for industrial environments, with future work focused on improving the detection of single-spike anomalies and borderline cases to enhance yield and operational reliability.
| Original language | English |
|---|---|
| Article number | 041402 |
| Journal | Journal of Micro/Nanopatterning, Materials and Metrology |
| Volume | 24 |
| Issue number | 4 |
| DOIs | |
| State | Published - 1 Oct 2025 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Keywords
- anomaly detection
- data normalization
- deep learning
- multivariate time series
- process control
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