Thermal modeling and device noise properties of 3D-SOI technology

Tze Wee Chen; Jung Hoon Chun; Yi Chang Lu; Reza Navid; Wei Wang; Robert W. Dutton

doi:10.1109/SOI.2007.4357866

Thermal modeling and device noise properties of 3D-SOI technology

Tze Wee Chen
, Jung Hoon Chun
, Yi Chang Lu
, Reza Navid
, Wei Wang
, Robert W. Dutton

Stanford University
Rambus Inc.
National Taiwan University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Original language	English
Title of host publication	2007 IEEE International SOI Conference Proceedings
Pages	89-90
Number of pages	2
DOIs	https://doi.org/10.1109/SOI.2007.4357866
State	Published - 2007
Externally published	Yes
Event	2007 IEEE International Systems-on-Chip Conference, SOI - Indian Wells, CA, United States Duration: 1 Oct 2007 → 4 Oct 2007

Publication series

Name	Proceedings - IEEE International SOI Conference
ISSN (Print)	1078-621X

Conference

Conference	2007 IEEE International Systems-on-Chip Conference, SOI
Country/Territory	United States
City	Indian Wells, CA
Period	1/10/07 → 4/10/07

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10.1109/SOI.2007.4357866

Cite this

@inproceedings{ee16017ef27f4e019c6b3b245ff5364b,

title = "Thermal modeling and device noise properties of 3D-SOI technology",

author = "Chen, \{Tze Wee\} and Chun, \{Jung Hoon\} and Lu, \{Yi Chang\} and Reza Navid and Wei Wang and Dutton, \{Robert W.\}",

year = "2007",

doi = "10.1109/SOI.2007.4357866",

language = "English",

isbn = "9781424408801",

series = "Proceedings - IEEE International SOI Conference",

pages = "89--90",

booktitle = "2007 IEEE International SOI Conference Proceedings",

note = "2007 IEEE International Systems-on-Chip Conference, SOI ; Conference date: 01-10-2007 Through 04-10-2007",

}

Chen, TW, Chun, JH, Lu, YC, Navid, R, Wang, W & Dutton, RW 2007, Thermal modeling and device noise properties of 3D-SOI technology. in 2007 IEEE International SOI Conference Proceedings., 4357866, Proceedings - IEEE International SOI Conference, pp. 89-90, 2007 IEEE International Systems-on-Chip Conference, SOI, Indian Wells, CA, United States, 1/10/07. https://doi.org/10.1109/SOI.2007.4357866

TY - GEN

T1 - Thermal modeling and device noise properties of 3D-SOI technology

AU - Chen, Tze Wee

AU - Chun, Jung Hoon

AU - Lu, Yi Chang

AU - Navid, Reza

AU - Wang, Wei

AU - Dutton, Robert W.

PY - 2007

Y1 - 2007

UR - https://www.scopus.com/pages/publications/43549115194

U2 - 10.1109/SOI.2007.4357866

DO - 10.1109/SOI.2007.4357866

M3 - Conference contribution

AN - SCOPUS:43549115194

SN - 9781424408801

T3 - Proceedings - IEEE International SOI Conference

SP - 89

EP - 90

BT - 2007 IEEE International SOI Conference Proceedings

T2 - 2007 IEEE International Systems-on-Chip Conference, SOI

Y2 - 1 October 2007 through 4 October 2007

ER -

Thermal modeling and device noise properties of 3D-SOI technology

Publication series

Conference

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