Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites
- Seunggun Yu
- , Do Kyun Kim
- , Cheolmin Park
- , Soon Man Hong
- , Chong Min Koo
- Yonsei University
- Korea Institute of Science and Technology
- University of Science and Technology UST
Research output: Contribution to journal › Article › peer-review
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