@inproceedings{c6689eaf0a984d6e96903fb49f179914,
title = "The synthesis of PS-SiO2 raspberry structure nanoparticle for CMP slurry",
abstract = "The properties of slurry particles are important factor on the polished surface quality in the CMP process. The composite abrasive is an interesting field in the CMP slurry study. And in this paper, we describe a method to synthesize raspberry structure PS-SiO2 composite nanoparticles and prepare the slurry for the wafer polishing. This novel composite abrasive can reduce the roughness and defects by the polishing experiment. Its removal rate is comparable to the commercial SiO2 slurry. The cushioning effect of soft PS core can decrease the excessive mechanical damage caused by hard silica abrasive.",
keywords = "CMP slurry, Polystyrene SiO nanoparticle, Raspberry structure",
author = "Hongyi Qin and Hojoong Kim and Hoomi Choi and Mingu Kim and Taesung Kim",
note = "Publisher Copyright: {\textcopyright} ICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings. All rights reserved.; 2012 International Conference on Planarization/CMP Technology, ICPT 2012 ; Conference date: 15-10-2012 Through 17-10-2012",
year = "2012",
language = "English",
series = "ICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings",
publisher = "VDE Verlag GmbH",
pages = "287--290",
booktitle = "ICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings",
}