The role of a ternary Ni-Sn-P layer as a diffusion barrier in the Sn-Ag solder/electroless Ni-P system
- Jee Hwan Bae
- , Han Byul Kang
- , Jiho Ryu
- , Cheol Woong Yang
- Sungkyunkwan University
- LG Corporation
- Ajou Motor College
Research output: Contribution to journal › Article › peer-review
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