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The mechanical effect of soft pad on copper chemical mechanical polishing

  • Pengzhan Liu
  • , Yuna Nam
  • , Seunghwan Lee
  • , Eungchul Kim
  • , Sanghuck Jeon
  • , Kihong Park
  • , Seokjun Hong
  • , Taesung Kim
  • Sungkyunkwan University
  • Samsung

Research output: Contribution to journal › Article › peer-review

18   Link opens in a new tab Scopus citations

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