The effect of tunnel barrier at resistive switching device for low power memory applications

Hyejung Choi, Jaeyun Yi, Sangmin Hwang, Sangkeum Lee, Seokpyo Song, Seunghwan Lee, Jaeyeon Lee, Donghee Son, Jinwon Park, Suk Ju Kim, Ja Yong Kim, Sunghoon Lee, Jiwon Moon, Choidong Kim, Jungwoo Park, Moonsig Joo, Jaesung Roh, Sungki Park, Sung Woong Chung, Junghoon RheeSung Joo Hong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

12 Scopus citations

Abstract

In order to realize the high density array device and suppress the disturbance between the cells, ReRAM also seem to need a selective device same as a diode in PCRAM. Still, while appropriate bipolar selective device doesn't show up, the tunnel barrier oxide embedded in ReRAM stack is one of the promising candidates for selective device of bipolar resistive switching memory. Additionally, using a tunnel barrier has a benefit to reduce the switching current. In this paper, bipolar memory devices with oxides such as HfO x, ZrOx and AlOx as a tunnel barrier were fabricated with 40 ∼ 80nm cell size. We showed that the switching current and inherent switching mechanism can be successfully controlled by proper tunnel barrier materials and stacks.

Original languageEnglish
Title of host publication2011 3rd IEEE International Memory Workshop, IMW 2011
DOIs
StatePublished - 2011
Externally publishedYes
Event2011 3rd IEEE International Memory Workshop, IMW 2011 - Monterey, CA, United States
Duration: 22 May 201125 May 2011

Publication series

Name2011 3rd IEEE International Memory Workshop, IMW 2011

Conference

Conference2011 3rd IEEE International Memory Workshop, IMW 2011
Country/TerritoryUnited States
CityMonterey, CA
Period22/05/1125/05/11

Keywords

  • component
  • heterostructure
  • oxide enthalpy of formation
  • resistive switching
  • tunnel barrier

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