Study on the Etching selectivity of oxide films in dry cleaning process with NF3 and H2O

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Dry cleaning process has been limited to particular field of removing native oxide because it has low etching selectivity for various oxide films. To increase etching selectivity, we added H2O steam feeding step before NF3 feeding step. From the experimental, we can change selectivity between oxide films from tens to hundreds.

Original languageEnglish
Title of host publicationUltra Clean Processing of Semiconductor Surfaces XIII
EditorsPaul W. Mertens, Marc Meuris, Marc Meuris, Marc Heyns
PublisherTrans Tech Publications Ltd
Pages86-90
Number of pages5
ISBN (Print)9783035710847
DOIs
StatePublished - 2016
Externally publishedYes
Event13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces , UCPSS 2016 - Knokke, Belgium
Duration: 12 Sep 201614 Sep 2016

Publication series

NameSolid State Phenomena
Volume255
ISSN (Print)1012-0394
ISSN (Electronic)1662-9779

Conference

Conference13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces , UCPSS 2016
Country/TerritoryBelgium
CityKnokke
Period12/09/1614/09/16

Keywords

  • Cleaning
  • Dry Cleaning
  • HF-Solution
  • NF+HO Dry Cleaning
  • NF–based Gas Cleaning
  • Oxide Film Etching
  • Selectivity

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