Abstract
The glancing incident angle of an extreme ultraviolet lithography (EUVL) system requires minimal thickness of absorber patterns to suppress the shadow effect. High etch selectivity and low EUV reflectance can be obtained by a TaN absorber with a Ru buffer layer, but this structure does not offer enough DUV contrast (absorber/ reflector) for inspection. A 20-nm-thick Al 2O3 anti-reflection coating on top of 27-nm-TaN/2-nm-Ru is proposed as one of the optimum absorber stacks, which can give high EUV and DUV contrast with the thinnest structure ever reported.
| Original language | English |
|---|---|
| Pages (from-to) | S721-S725 |
| Journal | Journal of the Korean Physical Society |
| Volume | 49 |
| Issue number | SUPPL. 3 |
| State | Published - Dec 2006 |
Keywords
- Absorber
- AlO
- ARC
- Buffer
- Capping
- EUVL
- TaN