Study of a thin Al2O3/TaN absorber stack on Ru-capped multilayers

Tae Geun Kim, Byung Hun Kim, In Yong Kang, Yong Chae Chung, Jinho Ahn, Seung Yoon Lee, In Sung Park, Chung Yong Kim, Nae Eung Lee

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

The glancing incident angle of an extreme ultraviolet lithography (EUVL) system requires minimal thickness of absorber patterns to suppress the shadow effect. High etch selectivity and low EUV reflectance can be obtained by a TaN absorber with a Ru buffer layer, but this structure does not offer enough DUV contrast (absorber/ reflector) for inspection. A 20-nm-thick Al 2O3 anti-reflection coating on top of 27-nm-TaN/2-nm-Ru is proposed as one of the optimum absorber stacks, which can give high EUV and DUV contrast with the thinnest structure ever reported.

Original languageEnglish
Pages (from-to)S721-S725
JournalJournal of the Korean Physical Society
Volume49
Issue numberSUPPL. 3
StatePublished - Dec 2006

Keywords

  • Absorber
  • AlO
  • ARC
  • Buffer
  • Capping
  • EUVL
  • TaN

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