Abstract
We have investigated electrical and structural properties of Pt/Pd/Au ohmic contact on p-type GaN:Mg (2.5 × 1017 cm-3) using Auger electron spectroscopy (AES) and glancing angle x-ray diffraction (GXRD) analysis. It was shown that the specific contact resistivity improved with increasing annealing temperature. The annealing of the contact at 600°C for 2 min in flowing N2 atmosphere resulted in a specific contact resistivity of 3.1 × 10-5 Ω cm2. Both GXRD and AES depth profile results show that Ga3Pt5, Ga 2Pd5, and Au7Ga2 phases are formed at the interface region between metal and GaN when annealed at temperatures 600°C. Possible explanation is suggested to describe the annealing dependence of the specific contact resistivity of the Pt/Pd/Au contacts.
| Original language | English |
|---|---|
| Pages (from-to) | 277-281 |
| Number of pages | 5 |
| Journal | Journal of Electroceramics |
| Volume | 17 |
| Issue number | 2-4 |
| DOIs | |
| State | Published - Dec 2006 |
| Externally published | Yes |