Abstract
Recently, sputter-deposited MoSi2 films have been successfully used as a barrier material in Nb/MoSi2/Nb Josephson junctions. In this report, we present our study on the deposition conditions of MoSi 2 film for electronics application. We investigated the film stress and sheet resistance as a function of deposition conditions. We also studied the micro-structural change in the film according to the deposition conditions using electron microscopes. We suggest that the thermal strain need to be considered in order to get a reliable junction.
| Original language | English |
|---|---|
| Article number | 5067267 |
| Pages (from-to) | 238-241 |
| Number of pages | 4 |
| Journal | IEEE Transactions on Applied Superconductivity |
| Volume | 19 |
| Issue number | 3 |
| DOIs | |
| State | Published - Jun 2009 |
| Externally published | Yes |
Keywords
- Josephson junction
- Silicide
- Sputter
- Stress
- Thin film