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Solid state interfacial reaction and joint strength of Sn-37Pb solder with Ni-P under bump metallization in flip chip application

  • Dae Gon Kim
  • , Jong Woong Kim
  • , Jung Goo Lee
  • , Hirotaro Mori
  • , David J. Quesnel
  • , Seung Boo Jung
  • Sungkyunkwan University
  • The University of Osaka
  • University of Rochester

Research output: Contribution to journal › Article › peer-review

37   Link opens in a new tab Scopus citations

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