TY - JOUR
T1 - Sn-3.0Ag-0.5Cu/OSP solder joints assembled using multi-wavelength light
AU - Lee, Hyo Won
AU - Noh, Eun Chae
AU - Kim, Jong Woong
AU - Jung, Seung Boo
AU - Yoon, Jeong Won
N1 - Publisher Copyright:
© 2025 Elsevier Ltd
PY - 2025/7
Y1 - 2025/7
N2 - We compared the properties of solder joints formed between the Sn-3.0Ag-0.5Cu (SAC305) solder and an organic solderability preservative (OSP)-coated substrate using different energy sources, such as air convection, infrared radiation, and multi-wavelength light. In conventional reflow soldering, the processing time can be lengthy because air convection is used to melt the solder, resulting in a coarse microstructure and thick intermetallic compound (IMC) layer. Laser soldering locally irradiates the solder with infrared radiation for a short time, whereas intense pulsed light (IPL) soldering uses multiwavelength light from Xe lamps to melt the solder through the photothermal effect, resulting in a short processing time. Consequently, immediately after laser and IPL soldering, the microstructure of the solder is fine and the IMC layer is thin. Isothermal aging treatment was performed at 150 °C for up to 1500 h to analyze the correlations between the solder microstructure, bonded interface, and mechanical reliability of joints. The thickness of the IMC layer increased with aging time. Moreover, ductile fractures in the solder bulk were observed in all the solder joints after aging. Immediately after soldering, the shear strength decreased in the following order: IPL > laser > reflow. During aging, the mechanical strength of the joint decreased because of solder softening and IMC layer growth. However, IPL soldering consistently maintained a high shear strength without a major reduction. IPL soldering is characterized by a short processing time, high energy efficiency, and excellent mechanical reliability of solder joints, making it a promising alternative to conventional reflow soldering.
AB - We compared the properties of solder joints formed between the Sn-3.0Ag-0.5Cu (SAC305) solder and an organic solderability preservative (OSP)-coated substrate using different energy sources, such as air convection, infrared radiation, and multi-wavelength light. In conventional reflow soldering, the processing time can be lengthy because air convection is used to melt the solder, resulting in a coarse microstructure and thick intermetallic compound (IMC) layer. Laser soldering locally irradiates the solder with infrared radiation for a short time, whereas intense pulsed light (IPL) soldering uses multiwavelength light from Xe lamps to melt the solder through the photothermal effect, resulting in a short processing time. Consequently, immediately after laser and IPL soldering, the microstructure of the solder is fine and the IMC layer is thin. Isothermal aging treatment was performed at 150 °C for up to 1500 h to analyze the correlations between the solder microstructure, bonded interface, and mechanical reliability of joints. The thickness of the IMC layer increased with aging time. Moreover, ductile fractures in the solder bulk were observed in all the solder joints after aging. Immediately after soldering, the shear strength decreased in the following order: IPL > laser > reflow. During aging, the mechanical strength of the joint decreased because of solder softening and IMC layer growth. However, IPL soldering consistently maintained a high shear strength without a major reduction. IPL soldering is characterized by a short processing time, high energy efficiency, and excellent mechanical reliability of solder joints, making it a promising alternative to conventional reflow soldering.
KW - IMCs
KW - IPL soldering
KW - Laser soldering
KW - OSP surface finish
KW - Reflow soldering
UR - https://www.scopus.com/pages/publications/105010168538
U2 - 10.1016/j.mtcomm.2025.113279
DO - 10.1016/j.mtcomm.2025.113279
M3 - Article
AN - SCOPUS:105010168538
SN - 2352-4928
VL - 47
JO - Materials Today Communications
JF - Materials Today Communications
M1 - 113279
ER -
