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Shear test parameters for brittle fracture of flip chip solder joint
S. S. Ha
,
J. W. Kim
, S. O. Ha
, S. B. Jung
Department of Semiconductor Convergence Engineering
Sungkyunkwan University
Research output
:
Contribution to journal
›
Article
›
peer-review
5
Scopus citations
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Engineering
Joints (Structural Components)
100%
Brittle Fracture
100%
Shear Force
40%
Simulation Result
20%
Intermetallics
20%
Compound Layer
20%
Failure Mechanism
20%
Ball Grid Arrays
20%
Free Solder
20%
Equivalent Plastic Strain
20%
Electroless Nickel
20%
Material Science
Shear Testing
100%
Solder Joint
100%
Brittle Fracture
100%
Intermetallics
20%
Lead-Free Solder
20%