Self-selective fine metal line coating using surface energy differences

Mu Kyeom Mun; Doo San Kim; Geun Young Yeom; Dong Woo Kim

doi:10.1016/j.mee.2017.11.012

Self-selective fine metal line coating using surface energy differences

Mu Kyeom Mun
, Doo San Kim
, Geun Young Yeom
, Dong Woo Kim

Department of Advanced Materials Science and Engineering

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

Self-selective coating is a new coating process that utilizes surface energy differences for metal ink coating. Hydrophobic and hydrophilic areas are defined on carbon black coated Polyimide (PI) substrate surface using atmospheric plasmas. At this state, when Ag ink is sprayed on PI, metal line is self-formed on hydrophilic surface due to its surface energy differences. As a result, an Ag ink line width of less than 6 μm could be formed on the PI surface after removing the carbon black. Due to the formation of the Ag line on the hydrophilic PI surface, the adhesion force of the Ag ink formed on the PI surface was ~ 64% higher than that of the Ag ink formed on the hydrophobic PI surface.

Original language	English
Pages (from-to)	33-38
Number of pages	6
Journal	Microelectronic Engineering
Volume	187-188
DOIs	https://doi.org/10.1016/j.mee.2017.11.012
State	Published - 5 Feb 2018

Keywords

Flexible device
Low temperature process
Self-selective coating
Surface energy

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10.1016/j.mee.2017.11.012

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@article{05860ac509ea4dbaab341426d012582a,

title = "Self-selective fine metal line coating using surface energy differences",

abstract = "Self-selective coating is a new coating process that utilizes surface energy differences for metal ink coating. Hydrophobic and hydrophilic areas are defined on carbon black coated Polyimide (PI) substrate surface using atmospheric plasmas. At this state, when Ag ink is sprayed on PI, metal line is self-formed on hydrophilic surface due to its surface energy differences. As a result, an Ag ink line width of less than 6 μm could be formed on the PI surface after removing the carbon black. Due to the formation of the Ag line on the hydrophilic PI surface, the adhesion force of the Ag ink formed on the PI surface was \textasciitilde{} 64\% higher than that of the Ag ink formed on the hydrophobic PI surface.",

keywords = "Flexible device, Low temperature process, Self-selective coating, Surface energy",

author = "Mun, \{Mu Kyeom\} and Kim, \{Doo San\} and Yeom, \{Geun Young\} and Kim, \{Dong Woo\}",

note = "Publisher Copyright: {\textcopyright} 2017",

year = "2018",

month = feb,

day = "5",

doi = "10.1016/j.mee.2017.11.012",

language = "English",

volume = "187-188",

pages = "33--38",

journal = "Microelectronic Engineering",

issn = "0167-9317",

publisher = "Elsevier B.V.",

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T1 - Self-selective fine metal line coating using surface energy differences

AU - Mun, Mu Kyeom

AU - Kim, Doo San

AU - Yeom, Geun Young

AU - Kim, Dong Woo

PY - 2018/2/5

Y1 - 2018/2/5

N2 - Self-selective coating is a new coating process that utilizes surface energy differences for metal ink coating. Hydrophobic and hydrophilic areas are defined on carbon black coated Polyimide (PI) substrate surface using atmospheric plasmas. At this state, when Ag ink is sprayed on PI, metal line is self-formed on hydrophilic surface due to its surface energy differences. As a result, an Ag ink line width of less than 6 μm could be formed on the PI surface after removing the carbon black. Due to the formation of the Ag line on the hydrophilic PI surface, the adhesion force of the Ag ink formed on the PI surface was ~ 64% higher than that of the Ag ink formed on the hydrophobic PI surface.

AB - Self-selective coating is a new coating process that utilizes surface energy differences for metal ink coating. Hydrophobic and hydrophilic areas are defined on carbon black coated Polyimide (PI) substrate surface using atmospheric plasmas. At this state, when Ag ink is sprayed on PI, metal line is self-formed on hydrophilic surface due to its surface energy differences. As a result, an Ag ink line width of less than 6 μm could be formed on the PI surface after removing the carbon black. Due to the formation of the Ag line on the hydrophilic PI surface, the adhesion force of the Ag ink formed on the PI surface was ~ 64% higher than that of the Ag ink formed on the hydrophobic PI surface.

KW - Flexible device

KW - Low temperature process

KW - Self-selective coating

KW - Surface energy

UR - https://www.scopus.com/pages/publications/85036450765

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DO - 10.1016/j.mee.2017.11.012

M3 - Article

AN - SCOPUS:85036450765

SN - 0167-9317

VL - 187-188

SP - 33

EP - 38

JO - Microelectronic Engineering

JF - Microelectronic Engineering

ER -

Self-selective fine metal line coating using surface energy differences

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Keywords

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