Schottky source/drain transistor on thin SiGe on insulator integrated with HfO2/TaN gate stack

  • Fei Gao
  • , S. J. Lee
  • , Rui Li
  • , S. Balakumar
  • , Chih Hang Tung
  • , Dong Zhi Chi
  • , Dim Lee Kwong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We report thin SGOI (Silicon Germanium on Insulator) with 65% Ge concentration p-MOSFET (Metal-Oxide-Semiconductor-Field-Effect-Transistor) using Ni-germanosilicide Schottky S/D (source/drain) and HfO2/TaN gate stack integrated with conventional self-aligned top gate process. Unlike high temperature S/D activation needed for conventional transistor, low Ni-germanosilicide S/D formation temperature contributes to the excellent capacitance-voltage characteristic, low gate leakage current and hence, well-behaved transistor performance. In addition, SOI structure suppresses the junction leakage problem, resulting in good agreement between the source current and drain current of the MOSFET.

Original languageEnglish
Title of host publicationTransistor Scaling-Methods, Materials and Modeling
PublisherMaterials Research Society
Pages19-25
Number of pages7
ISBN (Print)1558998691, 9781558998698
DOIs
StatePublished - 2006
Externally publishedYes
Event2006 MRS Spring Meeting - San Francisco, CA, United States
Duration: 18 Apr 200619 Apr 2006

Publication series

NameMaterials Research Society Symposium Proceedings
Volume913
ISSN (Print)0272-9172

Conference

Conference2006 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Francisco, CA
Period18/04/0619/04/06

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