Abstract
This letter presents a low-temperature process to fabricate Schottky-barrier silicide source/drain transistors (SSDTs) with high-κ gate dielectric and metal gate. For p-channel SSDTs (P-SSDT) using PtSi sourece/drain (S/D), excellent electrical performance of Ion/Ioff ∼ 107 - 108 and subthreshold slope of 66 mV/dec have been achieved. For n-channel SSDTs (N-SSDTs) using DySi2-x S/D, Ion/Ioff can reach ∼ 105 at Vds of 0.2 V with two subthreshold slopes of 80 and 340 mV/dec. The low-temperature process relaxes the thermal budget of high-κ dielectric and metal-gate materials to be used in the future generation CMOS technology.
| Original language | English |
|---|---|
| Pages (from-to) | 268-270 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 25 |
| Issue number | 5 |
| DOIs | |
| State | Published - May 2004 |
| Externally published | Yes |
Keywords
- High-κ
- Metal gate
- MOSFET
- Schottky
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