Abstract
The strong correlation between the microstructural characteristics of ZnO channel layers grown at various temperatures by radio-frequency magnetron sputtering and the electrical performances of resulting bottom-gate thin film transistors (TFTs) was reported. Transmission electron microscopy revealed that increasing growth temperature enhanced degree of c-axis preferred orientation and enlarged width of columns in the ZnO films. The ZnO channel layers grown at 250 and 350 °C exhibited TFT saturation behavior. However, growing them at ≤ 350 °C produced small grains in the junctions of ZnO/SiO2 interface and grain boundaries, which led to hump behavior in TFT transfer curve caused by formation of additional boundaries.
| Original language | English |
|---|---|
| Pages (from-to) | 6801-6805 |
| Number of pages | 5 |
| Journal | Thin Solid Films |
| Volume | 519 |
| Issue number | 20 |
| DOIs | |
| State | Published - 1 Aug 2011 |
Keywords
- Hump
- Microstructure
- Ostwald ripening
- Thin film transistor
- ZnO