Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0Ag–0.5Cu ball grid array package
- Kyung Deuk Min
- , Eun Ha
- , Sinyeob Lee
- , Jae Seon Hwang
- , Taegyu Kang
- , Jinho Joo
- , Seung Boo Jung
- Sungkyunkwan University
- Samsung
Research output: Contribution to journal › Article › peer-review
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