TY - JOUR
T1 - Pinwheel Meander-Perforated Plane Structure for Mitigating Power/Ground Noise in System-in-Package
AU - Han, Youngbong
AU - Huynh, Hai Au
AU - Kim, Soyoung
N1 - Publisher Copyright:
© 2011-2012 IEEE.
PY - 2018/4
Y1 - 2018/4
N2 - In this paper, a small electromagnetic bandgap structure that is suitable to be integrated into system-in-package is designed. The proposed structure, which is named as pinwheel perforated plane (PMPP), consists of meander line, mushroom-type patch, and the extended ground structure that is called a pinwheel. The proposed structure comprises three layers: top, middle, and ground. Moreover, the size of the proposed unit cell is 2.44 mm × 2.44 mm. The 3-D electromagnetic simulation results reveal that the cascaded 1× 2 PMPP structure generates a stopband frequency of 3.35-28.17 GHz at a suppression depth of -40 dB. The power/ground noise suppression effect is confirmed by dispersion analysis from 3-D electromagnetic solver eigenmodes. Signal and power co-simulations are also performed to validate its integrity.
AB - In this paper, a small electromagnetic bandgap structure that is suitable to be integrated into system-in-package is designed. The proposed structure, which is named as pinwheel perforated plane (PMPP), consists of meander line, mushroom-type patch, and the extended ground structure that is called a pinwheel. The proposed structure comprises three layers: top, middle, and ground. Moreover, the size of the proposed unit cell is 2.44 mm × 2.44 mm. The 3-D electromagnetic simulation results reveal that the cascaded 1× 2 PMPP structure generates a stopband frequency of 3.35-28.17 GHz at a suppression depth of -40 dB. The power/ground noise suppression effect is confirmed by dispersion analysis from 3-D electromagnetic solver eigenmodes. Signal and power co-simulations are also performed to validate its integrity.
KW - Electromagnetic bandgap (EBG)
KW - electromagnetic interference (EMI)
KW - integrated circuit (IC) package
UR - https://www.scopus.com/pages/publications/85042701053
U2 - 10.1109/TCPMT.2018.2798580
DO - 10.1109/TCPMT.2018.2798580
M3 - Article
AN - SCOPUS:85042701053
SN - 2156-3950
VL - 8
SP - 562
EP - 569
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
IS - 4
ER -