TY - GEN
T1 - Piezoelectric impedance sensor-based structural health monitoring for critical members of civil infrastructures
AU - Yun, Chung Bang
AU - Park, Seunghee
PY - 2008
Y1 - 2008
N2 - This paper presents novel structural health monitoring techniques for critical members of civil structures using electro-mechanical impedance sensors. The basic concept of this technique is to monitor critical locations of a structure for changes in structural impedance that would indicate imminent damage. In this paper, principal hardware and software issues on this topic are reviewed. An active sensing node incorporating on-board microprocessor and radio frequency telemetry is introduced in a sense of tailoring wireless sensing technology to the impedance method. A data compression algorithm using a principal component analysis is embedded into the on-board chip of the active sensing node. Finally, a method for compensating the temperature effects on the impedance measurements using cross-correlation analysis with effective frequency shifts is presented.
AB - This paper presents novel structural health monitoring techniques for critical members of civil structures using electro-mechanical impedance sensors. The basic concept of this technique is to monitor critical locations of a structure for changes in structural impedance that would indicate imminent damage. In this paper, principal hardware and software issues on this topic are reviewed. An active sensing node incorporating on-board microprocessor and radio frequency telemetry is introduced in a sense of tailoring wireless sensing technology to the impedance method. A data compression algorithm using a principal component analysis is embedded into the on-board chip of the active sensing node. Finally, a method for compensating the temperature effects on the impedance measurements using cross-correlation analysis with effective frequency shifts is presented.
KW - Civil Infrastructures
KW - Impedance
KW - Piezoelectric Sensors
KW - Structural Health Monitoring
UR - https://www.scopus.com/pages/publications/62449236792
U2 - 10.4028/www.scientific.net/AST.56.395
DO - 10.4028/www.scientific.net/AST.56.395
M3 - Conference contribution
AN - SCOPUS:62449236792
SN - 9783908158134
T3 - CIMTEC 2008 - Proceedings of the 3rd International Conference on Smart Materials, Structures and Systems - Emboding Intelligence in Structures and Integrated Systems
SP - 395
EP - 400
BT - CIMTEC 2008 - Proceedings of the 3rd International Conference on Smart Materials, Structures and Systems - Emboding Intelligence in Structures and Integrated Systems
PB - Trans Tech Publications Ltd
T2 - 3rd International Conference on Smart Materials, Structures and Systems - Embodying Intelligence in Structures and Integrated Systems, CIMTEC 2008
Y2 - 8 June 2008 through 13 June 2008
ER -