Photoresponse of a YBa2Cu3Ox grain-boundary junction

J. H. Park, D. H. Kim, Y. H. Kim, W. N. Kang, S. S. Choi, T. S. Hahn, Z. G. Khim

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Abstract

The photoresponse of a YBa2Cu3Ox grain-boundary junction has been measured as a function of chopping frequency and bias current in a temperature range of 2 K≤T≤70 K. The response was found to be mostly bolometric, but a nonbolometriclike component was also identified, which appeared as a chopping-frequency independent signal while immersing the sample in the superfluid helium. The bias-current dependence of the response showed a peak at a current corresponding to the critical current of the junction, and the peak values remained constant for 30 K<T<70 K. However, below 15 K the peak of the photoresponse increased very sharply with decreasing temperature following a 1/T3 dependence, consistent with the temperature dependence of the thermal boundary resistance between the film and the substrate.

Original languageEnglish
Pages (from-to)3770-3773
Number of pages4
JournalJournal of Applied Physics
Volume79
Issue number7
DOIs
StatePublished - 1 Apr 1996
Externally publishedYes

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