Skip to main navigation Skip to search Skip to main content

Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs

  • Jeong Hyeon Park
  • , Hwanjoo Park
  • , Taehwan Kim
  • , Jaechoon Kim
  • , Eun Ho Lee
  • Sungkyunkwan University
  • Samsung

Research output: Contribution to journal › Article › peer-review

23   Link opens in a new tab Scopus citations

Fingerprint

Dive into the research topics of 'Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs'. Together they form a unique fingerprint.
Sort by

Engineering

Material Science

Chemical Engineering