Novel fabrication techniques for ultra-thin silicon based flexible electronics

Highlights Flexible silicon manufacturing techniques are categorized into two main approaches: top-down and bottom-up depending on the process sequence. The top-down approach is a method of producing the bulk silicon wafer by scaling down it into nano/micro-sized structures. The bottom-up approach is a method of creating an intricate structure through precise control of small-scale atoms and molecules. Flexible silicon maintains the advantages of the bulk silicon such as electrical properties, reliability, and cost-effectiveness.