Abstract
A vertical cell is the best structure for optimizing dynamic random access memory size. However, this structure has a fatal weakness called the floating-body effect (FBE). In this letter, we propose a new vertical structure to suppress FBE and short-channel effects, and successfully demonstrate the structure through simulation. In the new structure, the band-to-band tunnel diode body contact is built in the source region, which effectively releases the accumulated body carriers. In the buried contact, a heavily doped p+ layer is introduced next to the n+ source region, effectively connecting the body and source through tunneling. Furthermore, the proposed structure shows an extremely high ON-state to OFF-state current (ION/IOFF) ratio of 107 for a channel length of 100 nm.
| Original language | English |
|---|---|
| Article number | 8485339 |
| Pages (from-to) | 1860-1863 |
| Number of pages | 4 |
| Journal | IEEE Electron Device Letters |
| Volume | 39 |
| Issue number | 12 |
| DOIs | |
| State | Published - Dec 2018 |
Keywords
- 4F
- bipolar junction transistor (BJT)
- DRAM chips
- memory architecture
- vertical cell array