@inproceedings{2fbd330d3de84aeeba8d04ee9284d569,
title = "Multiple Bus Design Methodology for Low Loss and Low Crosstalk with Mesh Ground in FPCB",
abstract = "In this paper, we propose a design methodology for multiple bus structures implemented on flexible printed circuit board (FPCB) with mesh ground structure. The proposed methodology suggested an optimum distance of the signal lines and relative location with respect to the grid to guarantee the 50\textbackslash{}Omega characteristic impedance without resonance in insertion loss and with minimum crosstalk. Also, the proposed design shows identical impedance of signal lines in time-domain-reflectometer (TDR) measurements and improves Far-End Crosstalk (FEXT) by 4.3 dB in and Near-End Crosstalk (NEXT) 6.1 dB with respect to conventional design (signal lines with 50\textbackslash{}Omega characteristic impedance at grid center) at 1.25 GHz for the design targeted to be used at C-PHY with 20-mm multiple bus structures in 2-layer FPCB using polyimide.",
keywords = "crosstalk, flexible printed circuit board, mesh ground, multilevel signal",
author = "Le, \{Hung Khac\} and \{Van Nguyen\}, Hoang and Youngbong Han and Kim, \{So Young\}",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020 ; Conference date: 28-07-2020 Through 28-08-2020",
year = "2020",
month = jul,
doi = "10.1109/EMCSI38923.2020.9191472",
language = "English",
series = "2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "578--580",
booktitle = "2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020",
}