Abstract
We evaluated the characteristics of methanesulfonic acid (MSA) as a supporting electrolyte in copper electroplating in terms of copper ion solubility, i-V behavior, and compatibility with additives for copper filling. Although the solubility of copper ion in MSA is higher than that in sulfuric acid, linear sweep voltametry analysis showed that the current density from MSA electrolyte was lower than that from sulfuric acid, due to its high solution resistance. Additives in MSA electrolyte behaved in the same way as in sulfuric acid, and the complete filling of damascene trenches and through silicon vias (TSVs) were obtained with PEG-Cl-SPS additives.
| Original language | English |
|---|---|
| Pages (from-to) | D52-D56 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 14 |
| Issue number | 5 |
| DOIs | |
| State | Published - 2011 |
| Externally published | Yes |