TY - GEN
T1 - Microstructure and composition of Au-Sn eutectic solder electroplated from a single solution
AU - Jeong, G. H.
AU - Kim, J. H.
AU - Lee, Duhyun
AU - Suh, S. J.
PY - 2006
Y1 - 2006
N2 - In this study, we produced Au-Sn alloy electroplated from a single solution and optimized the composition. The composition of electroplated Au-Sn alloy was Au-31.02 at.% Sn at the condition of 6 ms on - 4 ms off pulse current, 50 and 10 mA/cm2, Results in XRD analysis showed that Au-Sn alloy electroplated at DC 10 mA/cm2 had AuSn phase (ξ′) only and Au5Sn phase (δ) appeared with decreasing the pulsed current on time. Also micropattemed Au-Sn solder bump was produced by photolithography. Though it's composition of Au-35.98 at.% Sn was not optimum, we tried to bond between Au-Sn solder bump and Si wafer that was coated with Ti (100 nm)/Au (300 nm).
AB - In this study, we produced Au-Sn alloy electroplated from a single solution and optimized the composition. The composition of electroplated Au-Sn alloy was Au-31.02 at.% Sn at the condition of 6 ms on - 4 ms off pulse current, 50 and 10 mA/cm2, Results in XRD analysis showed that Au-Sn alloy electroplated at DC 10 mA/cm2 had AuSn phase (ξ′) only and Au5Sn phase (δ) appeared with decreasing the pulsed current on time. Also micropattemed Au-Sn solder bump was produced by photolithography. Though it's composition of Au-35.98 at.% Sn was not optimum, we tried to bond between Au-Sn solder bump and Si wafer that was coated with Ti (100 nm)/Au (300 nm).
UR - https://www.scopus.com/pages/publications/33745346909
M3 - Conference contribution
AN - SCOPUS:33745346909
SN - 1558998489
SN - 9781558998483
T3 - Materials Research Society Symposium Proceedings
SP - 85
EP - 89
BT - Materials Research Society Symposium Proceedings
T2 - Combinatorial Methods and Informatics in Materials Science
Y2 - 28 November 2005 through 1 December 2005
ER -