Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
- Sang Eun Han
- , Dong Gyu Choi
- , Seonghui Han
- , Tae Young Lee
- , Deok Gon Han
- , Hoo Jeong Lee
- , Sehoon Yoo
- Korea Institute of Industrial Technology
- Sungkyunkwan University
- Kyonggi University
- Andong National University
- Tech University of Korea
- Ltd.
Research output: Contribution to journal › Article › peer-review
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