Abstract
In recent years, micro-LED technology has become crucial for high-definition AR/VR displays and large TVs. ENJET addresses production challenges with a specialized bonder machine, employing EHD Printing, 1-by-1 transfer for precise, defect-free micro-LED production. This work demonstrated dispensing up to 7 µm conductive bond dots via EHD inkjet printing, achieving a placement precision of 1.5 µm in both x and y directions.
| Original language | English |
|---|---|
| Pages (from-to) | 1786-1787 |
| Number of pages | 2 |
| Journal | Digest of Technical Papers - SID International Symposium |
| Volume | 55 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2024 |
| Externally published | Yes |
| Event | International Symposium, Seminar, and Exhibition, Display Week 2024 - San Jose, United States Duration: 12 May 2024 → 17 May 2024 |
Keywords
- EHD Printing
- Micro bonder
- Precision chip transfer
- Precision dispensing