MBus: A System Integration Bus for the Modular Microscale Computing Class

Pat Pannuto, Yoonmyung Lee, Ye Sheng Kuo, Zhi Yoong Foo, Benjamin Kempke, Gyouho Kim, Ronald G. Dreslinski, David Blaauw, Prabal Dutta

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

I/O has become the limiting factor in scaling down size and power toward the goal of invisible computing. Achieving this goal will require composing optimized and specialized - yet reusable - components with an interconnect that permits tiny, ultra-low-power systems. In contrast to today's interconnects, which are limited by power-hungry pull-ups or high-overhead chip select lines, the authors' approach operates at lower power, with a fixed pin count, using fully synthesizable logic, and with surprisingly low-protocol overhead. The authors present MBus, a new four-pin, 22.6 pJ/bit/chip chip-to-chip interconnect made of two 'shoot-through' rings. MBus facilitates ultra-low-power system operation by automatically power gating each chip in the system, easing the integration of active and inactive circuits. In addition, they introduce power-oblivious communication, which guarantees message reception even if the recipient is inactive. This disentangles power management from communication, greatly simplifying the creation of viable, modular, and heterogeneous systems that draw nanowatts.

Original languageEnglish
Article number7484947
Pages (from-to)60-70
Number of pages11
JournalIEEE Micro
Volume36
Issue number3
DOIs
StatePublished - 1 May 2016

Keywords

  • interconnects
  • microscale systems
  • millimeter-scale systems
  • ultra-low power

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