Abstract
In this paper, the effect of polyimide surface modification – using near-atmospheric pressure plasmas – on the line width and adhesion of inkjet-printed Ag was investigated by texturing and modifying the chemical composition of the polyimide surface. The polyimide surface was textured with He/O2, to increase the surface area of the polyimide substrate and it increased the water contact angle from 57 to 137°, when the textured polyimide surface was treated with a SF6 plasma after the texturing process. The textured polyimide surface also exhibited the increased adhesion strength of Ag film (by about two times), due to the increase in the contact area, as expected, according to the Wenzel model. The linewidth of the inkjet-printed Ag line decreased by about ten times from 330 µm (for the flat polyimide surface) to 23 µm (for the textured polyimide surface) in addition to having smoother line edges.
| Original language | English |
|---|---|
| Pages (from-to) | 722-729 |
| Number of pages | 8 |
| Journal | Plasma Processes and Polymers |
| Volume | 13 |
| Issue number | 7 |
| DOIs | |
| State | Published - 1 Jul 2016 |
Keywords
- direct patterning
- flexible device
- inkjet printing
- near-atmospheric pressure plasma
- surface modification