Investigations on the mechanism of silica particle removal during the Cu buff cleaning process
- Pengzhan Liu
- , Seokjun Hong
- , Sanghuck Jeon
- , Jaewon Lee
- , Donggeon Kwak
- , Yutaka Wada
- , Hirokuni Hiyama
- , Satomi Hamada
- , Taesung Kim
- Sungkyunkwan University
- Ebara Corporation
Research output: Contribution to journal › Article › peer-review
11
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