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Investigation on output driver with stacked devices for ESD design window engineering

  • Shuqing Cao
  • , Jung Hoon Chun
  • , Eunji Choi
  • , Stephen Beebe
  • , Warren Anderson
  • , Robert Dutton
  • Stanford University
  • Sungkyunkwan University
  • Global Foundries, Inc.
  • Advanced Micro Devices

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This work investigates the ESD robustness of stacked drivers in bulk and SOI technologies. The impact of stacked driver sizing and pre-driver connection is examined in detail using VF-TLP and TLP measurement. It is shown that proper pre-driver configuration can double Vt2, thereby improving I/O's It2.

Original languageEnglish
Title of host publicationElectrical Overstress/Electrostatic Discharge Symposium Proceedings 2010, EOS/ESD 2010
StatePublished - 2010
Event32nd Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2010 - Reno, NV, United States
Duration: 3 Oct 2010 → 8 Oct 2010

Publication series

NameElectrical Overstress/Electrostatic Discharge Symposium Proceedings
ISSN (Print)0739-5159

Conference

Conference32nd Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2010
Country/TerritoryUnited States
CityReno, NV
Period3/10/10 → 8/10/10

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