Investigation of copper oxide ring formation during post chemical mechanical polishing cleaning of Cu interconnect
- Hojoong Kim
- , Seokjun Hong
- , Yinhua Jin
- , Dong Hyun Lim
- , Jun yong Kim
- , Hasub Hwang
- , Taesung Kim
- Samsung
- Sungkyunkwan University
Research output: Contribution to journal › Article › peer-review
10
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