Abstract
An experiential aspect regarding the improvement of retention characteristics of InSnZnO (ITZO) thin-film transistor-based nonvolatile memory (TFT-NVM) devices with a hydrogen peroxide H2O2 treated Aluminum oxide (Al2O3) tunneling layer is reported. A better performance in retention of ∼ 92 % (after ten years), a smaller subthreshold swing of 96 mV/decade, and a higher field effect mobility of 31.08 cm2V·s were obtained in H2O2 treated TFT-NVM devices compared with untreated one. Furthermore, employing the H2O2treatment in the Al2O3 layer provided oxygen-rich (O/Al ratio = 1.45) and OH- residuals free Al2O3, which effectively minimized the interface states ( 1.34 × 1011 cm-2 eV-1) between the ITZO/(Al2O3/SiOx/SiO2) stack through strong oxidation. These results suggest that high-quality Al2O3 dielectric layer can be obtained through cost-effective H2O2 oxidation techniques for TFT-NVM devices.
| Original language | English |
|---|---|
| Article number | 7542157 |
| Pages (from-to) | 1272-1275 |
| Number of pages | 4 |
| Journal | IEEE Electron Device Letters |
| Volume | 37 |
| Issue number | 10 |
| DOIs | |
| State | Published - Oct 2016 |
Keywords
- AlO
- Charge trap memory
- ITZO NVM
- low-temperature oxidation
- peroxo group