High temperature thermoelectric properties of TiNiSn-based half-Heusler compounds

Sung Wng Kim; Yoshisato Kimura; Yoshinao Mishima

doi:10.1016/j.intermet.2006.08.008

High temperature thermoelectric properties of TiNiSn-based half-Heusler compounds

Sung Wng Kim, Yoshisato Kimura, Yoshinao Mishima

Institute of Science Tokyo

Research output: Contribution to journal › Article › peer-review

143 Scopus citations

Abstract

A class of intermetallics of TiNiSn half-Heusler compound with MgAgAs structure type is currently of interest as a potential high temperature thermoelectric material. The ternary TiNiSn compound has showed promising thermoelectric properties, a high Seebeck coefficient and low electrical resistivity. The present study reports the effect of Hf alloying on Ti site, Pt and Pd alloying on Ni site, and Sb doping on Sn site for the optimization of thermoelectric properties of TiNiSn-based compounds. Also, to achieve a low thermal conductivity, a powder metallurgy technique is used for the fabrication of the compounds. These efforts result in the dimensionless figure of merit, ZT as 0.78 for the hot-pressed (Ti_0.95Hf_0.05)Ni(Sn_0.99Sb_0.01) sample at 770 K with a large power factor (4.1 mW/mK²), which makes these materials very attractive for potential power generation applications.

Original language	English
Pages (from-to)	349-356
Number of pages	8
Journal	Intermetallics
Volume	15
Issue number	3
DOIs	https://doi.org/10.1016/j.intermet.2006.08.008
State	Published - Mar 2007
Externally published	Yes

Keywords

A. Ternary alloy systems
B. Thermoelectric properties
C. Powder metallurgy

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10.1016/j.intermet.2006.08.008

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title = "High temperature thermoelectric properties of TiNiSn-based half-Heusler compounds",

abstract = "A class of intermetallics of TiNiSn half-Heusler compound with MgAgAs structure type is currently of interest as a potential high temperature thermoelectric material. The ternary TiNiSn compound has showed promising thermoelectric properties, a high Seebeck coefficient and low electrical resistivity. The present study reports the effect of Hf alloying on Ti site, Pt and Pd alloying on Ni site, and Sb doping on Sn site for the optimization of thermoelectric properties of TiNiSn-based compounds. Also, to achieve a low thermal conductivity, a powder metallurgy technique is used for the fabrication of the compounds. These efforts result in the dimensionless figure of merit, ZT as 0.78 for the hot-pressed (Ti0.95Hf0.05)Ni(Sn0.99Sb0.01) sample at 770 K with a large power factor (4.1 mW/mK2), which makes these materials very attractive for potential power generation applications.",

keywords = "A. Ternary alloy systems, B. Thermoelectric properties, C. Powder metallurgy",

author = "Kim, \{Sung Wng\} and Yoshisato Kimura and Yoshinao Mishima",

year = "2007",

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doi = "10.1016/j.intermet.2006.08.008",

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journal = "Intermetallics",

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T1 - High temperature thermoelectric properties of TiNiSn-based half-Heusler compounds

AU - Kim, Sung Wng

AU - Kimura, Yoshisato

AU - Mishima, Yoshinao

PY - 2007/3

Y1 - 2007/3

N2 - A class of intermetallics of TiNiSn half-Heusler compound with MgAgAs structure type is currently of interest as a potential high temperature thermoelectric material. The ternary TiNiSn compound has showed promising thermoelectric properties, a high Seebeck coefficient and low electrical resistivity. The present study reports the effect of Hf alloying on Ti site, Pt and Pd alloying on Ni site, and Sb doping on Sn site for the optimization of thermoelectric properties of TiNiSn-based compounds. Also, to achieve a low thermal conductivity, a powder metallurgy technique is used for the fabrication of the compounds. These efforts result in the dimensionless figure of merit, ZT as 0.78 for the hot-pressed (Ti0.95Hf0.05)Ni(Sn0.99Sb0.01) sample at 770 K with a large power factor (4.1 mW/mK2), which makes these materials very attractive for potential power generation applications.

AB - A class of intermetallics of TiNiSn half-Heusler compound with MgAgAs structure type is currently of interest as a potential high temperature thermoelectric material. The ternary TiNiSn compound has showed promising thermoelectric properties, a high Seebeck coefficient and low electrical resistivity. The present study reports the effect of Hf alloying on Ti site, Pt and Pd alloying on Ni site, and Sb doping on Sn site for the optimization of thermoelectric properties of TiNiSn-based compounds. Also, to achieve a low thermal conductivity, a powder metallurgy technique is used for the fabrication of the compounds. These efforts result in the dimensionless figure of merit, ZT as 0.78 for the hot-pressed (Ti0.95Hf0.05)Ni(Sn0.99Sb0.01) sample at 770 K with a large power factor (4.1 mW/mK2), which makes these materials very attractive for potential power generation applications.

KW - A. Ternary alloy systems

KW - B. Thermoelectric properties

KW - C. Powder metallurgy

UR - https://www.scopus.com/pages/publications/33845327999

U2 - 10.1016/j.intermet.2006.08.008

DO - 10.1016/j.intermet.2006.08.008

M3 - Article

AN - SCOPUS:33845327999

SN - 0966-9795

VL - 15

SP - 349

EP - 356

JO - Intermetallics

JF - Intermetallics

IS - 3

ER -

High temperature thermoelectric properties of TiNiSn-based half-Heusler compounds

Abstract

Keywords

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