High-rate dry etching of ZnO in BCl3/CH4/H2 plasmas

  • Jeong Woon Bae
  • , Chang Hyun Jeong
  • , Han Ki Kim
  • , Kyoung Kook Kim
  • , Nam Gil Cho
  • , Tae Yeon Seong
  • , Seong Ju Park
  • , Ilesanmi Adesida
  • , Geun Young Yeom

Research output: Contribution to journalArticlepeer-review

43 Scopus citations

Abstract

High-rate dry etching characteristics of aluminum-doped zinc oxide (AZO) have been investigated in inductively coupled plasma (ICP) using BCl3/CH4/H2 plasma chemistry. Etch rates were measured as a function of BCl3 flow rate in BCl3/CH4H2 mixture and de-bias voltage. Measurement of etch rate, and etched sidewall profile were performed using a stylus profilometer and scanning electron microscopy, respectively. The highest AZO etch rate about 310 nm/min, could be obtained near 80% BCl3 and at de-bias voltage of -350 V.

Original languageEnglish
Pages (from-to)L535-L537
JournalJapanese Journal of Applied Physics
Volume42
Issue number5 B
DOIs
StatePublished - 15 May 2003

Keywords

  • AZO
  • BCl
  • Bias voltage
  • Etch profile
  • Inductively coupled plasma

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