Abstract
High quality Ta2O5 gate stack with Tox,eq =9 angstrom (measured Vg=-2.5V in strong accumulation without taking quantum mechanical effects into account) and the leakage current Jg=-0.19 A/cm2 Vg=-1.0V has been achieved using NH3-based interface layer, H2/O2 post-deposition anneal and TiN diffusion barrier. The leakage current of Ta2O5 gate stack with NO interface layer is 104 × lower than that of RTP SiO2 with same Tox,eq and can be further reduced by a factor of 100 with NH3-based interface layer.
| Original language | English |
|---|---|
| Pages (from-to) | 141-144 |
| Number of pages | 4 |
| Journal | Technical Digest - International Electron Devices Meeting |
| State | Published - 1999 |
| Externally published | Yes |
| Event | 1999 IEEE International Devices Meeting (IEDM) - Washington, DC, USA Duration: 5 Dec 1999 → 8 Dec 1999 |