High quality Ta2O5 gate dielectrics with Tox,eq < 10 angstrom

H. F. Luan, S. J. Lee, C. H. Lee, S. C. Song, Y. L. Mao, Y. Senzaki, D. Roberts, D. L. Kwong

Research output: Contribution to journalConference articlepeer-review

31 Scopus citations

Abstract

High quality Ta2O5 gate stack with Tox,eq =9 angstrom (measured Vg=-2.5V in strong accumulation without taking quantum mechanical effects into account) and the leakage current Jg=-0.19 A/cm2 Vg=-1.0V has been achieved using NH3-based interface layer, H2/O2 post-deposition anneal and TiN diffusion barrier. The leakage current of Ta2O5 gate stack with NO interface layer is 104 × lower than that of RTP SiO2 with same Tox,eq and can be further reduced by a factor of 100 with NH3-based interface layer.

Original languageEnglish
Pages (from-to)141-144
Number of pages4
JournalTechnical Digest - International Electron Devices Meeting
StatePublished - 1999
Externally publishedYes
Event1999 IEEE International Devices Meeting (IEDM) - Washington, DC, USA
Duration: 5 Dec 19998 Dec 1999

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