High-performance heat-sink composites incorporating micron-sized inorganic fillers and sn/in metal particles

A novel thermal-barrier composite system was developed by incorporating fusible metal particles in the epoxy matrix system. Using the latent heat of melting, the Sn/In metal particles having melting temperature at 125°C were imbedded in the polymer matrix to suppress the thermal shock and transient temperature variation. The high-density metal particles were successfully dispersed in the polymer matrix without sinking by incorporating inorganic particles of aluminum nitride (AlN) and boron nitride (BN), which desirably facilitated the heat dissipation to give a high thermal conductivity at around 10 W/m-K. Under the repeated melting and cooling cycles, the spherical shape of metal particles and the latent heat of melting were retained demonstrating the reversible thermal-barrier capability of the developed composite system. Under the constantheating conditions, it was validated that the temperature rise was delayed by the endothermic melting of Sn/In particles. The developed composite system could find various applications since it could minimize damages caused by the repeated thermal fatigue and/or accidental thermal shock.