Abstract
Low-temperature poly-silicon thin-film transistors (LTPS-TFTs) on glass substrates in modular micro-LED displays have metal electrodes which are externally exposed to connect LED chips and pads. This structure increases the risk of electrostatic discharge (ESD) from the external environment. Furthermore, glass substrates cause high visible light reflectance. To improve the ESD robustness and reduce visible light reflectance, a backplane structure with a black fine metal mesh is proposed. Modular micro-LED displays with the proposed structure achieved the ESD tolerance higher than 8kV through the standard system-level ESD test and reduced the average visible light reflectance by more than 80%.
| Original language | English |
|---|---|
| Pages (from-to) | 75-78 |
| Number of pages | 4 |
| Journal | Digest of Technical Papers - SID International Symposium |
| Volume | 51 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2020 |
| Event | 57th SID International Symposium, Seminar and Exhibition, Display Week, 2020 - Virtual, Online Duration: 3 Aug 2020 → 7 Aug 2020 |
Keywords
- Black fine metal mesh
- Electrostatic discharge (ESD)
- Low-temperature poly-silicon thin-film transistors (LTPS-TFTs)
- Modular micro-LED
- Visible light reflectance