Abstract
In this letter, HfO 2-based RRAM with varying device sizes is discussed with an analysis of the device-size dependence on reset current (I reset). Device sizes down to 60 nm were achieved by using different thicknesses of nitride spacer after 200-nm contact hole is formed. Platinum (Pt) bottom electrode and titanium nitride (TiN) top electrode were used with HfO 2 dielectric as the resistance switching layer. Uniform bipolar switching characteristics with a very low I reset of about 100 μA are achieved in 60-nm contact size devices. Self-compliance effect is also observed in the scaled devices.
| Original language | English |
|---|---|
| Article number | 6205602 |
| Pages (from-to) | 1060-1062 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 33 |
| Issue number | 7 |
| DOIs | |
| State | Published - 2012 |
| Externally published | Yes |
Keywords
- Bipolar switching
- resistive random access memory (RRAM)
- self-compliance
Fingerprint
Dive into the research topics of 'HfO 2-Based RRAM devices with varying contact sizes and their electrical behavior'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver