Abstract
We report growth of Si1 - xGex/Si and Ge on insulator by Ge diffusion and SPE (solid phase epitaxy). Different annealing conditions were carried out and evaluated by X-ray diffraction. Ge diffusion and SPE growth of Ge on Si are observed after annealing at 800 °C. EDX (electron dispersive X-ray) composition analysis shows that the top 100 Å Si 1 - xGex layer is quite uniform with Ge content variation of less than 2%. TEM (transmission electron microscopy) picture shows no crystal orientation misalignment between the Si and the top Si1 - xGe x layer. This simple and cost-effective process can be used to make Si1 - xGex /Si substrate for high-mobility metal oxide semiconductor field effect transistor application. In addition, Ge on insulator structure was achieved by SPE lateral growth on pre-patterned SiO2.
| Original language | English |
|---|---|
| Pages (from-to) | 69-72 |
| Number of pages | 4 |
| Journal | Thin Solid Films |
| Volume | 504 |
| Issue number | 1-2 |
| DOIs | |
| State | Published - 10 May 2006 |
| Externally published | Yes |
Keywords
- GOI
- MOSFET
- SiGe
- Solid phase epitaxy