TY - GEN
T1 - Fully roll-to-roll gravure printed carbon nanotube based flexible thin film transistor backplane on 100 m of poly(ethyleneterephtalate) (PET) web
AU - Lee, Wookyu
AU - Koo, Hyunmo
AU - Sun, Junfeng
AU - Choi, Yunchang
AU - Cho, Gyoujin
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/11/18
Y1 - 2014/11/18
N2 - R2R gravure with two printing units with the overlay printing registration accuracy of ±20 μm is introduced to fabricate 20 × 20 TFTs backplane on 150 m of PET web. The resultants of fully printed TFT backplanes were characterized based on the concept to extract the scalability for manufacturing wall paper like sensor sheets. In this gravure system, silver nanoparticle based conductive ink, BaTiO3 based dielectric ink and single walled carbon nanotube based semiconducting ink were used for printing 20 × 20 TFT backplanes on 100 m of PET web. Rheological properties were optimized with the consideration of printing reliability and electrical properties of resulting TFTs. Mobility, transconductance, threshold voltage, and on-off current ratio of 20 × 20 printed TFT backplanes were analyzed for extracting the parameters to define the scalability factors for practical applications.
AB - R2R gravure with two printing units with the overlay printing registration accuracy of ±20 μm is introduced to fabricate 20 × 20 TFTs backplane on 150 m of PET web. The resultants of fully printed TFT backplanes were characterized based on the concept to extract the scalability for manufacturing wall paper like sensor sheets. In this gravure system, silver nanoparticle based conductive ink, BaTiO3 based dielectric ink and single walled carbon nanotube based semiconducting ink were used for printing 20 × 20 TFT backplanes on 100 m of PET web. Rheological properties were optimized with the consideration of printing reliability and electrical properties of resulting TFTs. Mobility, transconductance, threshold voltage, and on-off current ratio of 20 × 20 printed TFT backplanes were analyzed for extracting the parameters to define the scalability factors for practical applications.
UR - https://www.scopus.com/pages/publications/84918590337
U2 - 10.1109/ESTC.2014.6962824
DO - 10.1109/ESTC.2014.6962824
M3 - Conference contribution
AN - SCOPUS:84918590337
T3 - ESTC 2014 - 5th Electronics System-Integration Technology Conference
BT - ESTC 2014 - 5th Electronics System-Integration Technology Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th Electronics System-Integration Technology Conference, ESTC 2014
Y2 - 16 September 2014 through 18 September 2014
ER -
